Soft lithography based on photocurable perfluoropolyether (PFPE) was used to mold and replicate poly(styrene-b-isoprene) block-copolymer micelles within a broad range of shapes and sizes including sph...
Abstract
An injection molding technique for epoxy molding compounds is described that has significant advantages in performance, efficiency and reliability. This technique has utility in many applica...
Abstract
An injection molding technique for epoxy molding compounds is described that has significant advantages in performance, efficiency and reliability. This technique has utility in many applica...
Abstract
Flip chip assemblies are underfilled to improve their reliability by increasing the solder joint fatigue lifetime. Historically, flip chips have been underfilled with a capillary liquid unde...
Abstract
Silicon carbide (SiC) molds for micro/nano glass press molding at high temperature were fabricated from a silicon mold. The silicon molds with the features of micro-optics were fabricated by...