IEEE |
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Views: (2005) Date: (Publication Date: Jul 1983) Pages: () |
Abstract: Abstract We have developed a method for measuring the thickness of thin films that is nondestructive, noncontact and that can make measurements with 2-m spatial resolution (i.e., 2-m spot size) on both optically opaque as well as optically transparent films. With this method, which is based on the use of high-frequency thermal waves, thicknesses of Al and SiO2 films on Si substrates have been measured in the 50025?000- range.