FinFET-a self-aligned double-gate MOSFET scalable to 20 nm


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    Views: (2006)   Date: (Publication Date: Dec 2000)   Pages: ()
  • Author:  Hisamoto  D. Wen-Chin Lee Kedzierski  J. Takeuchi  H. Asano  K. Kuo  C. Anderson  E. Tsu-Jae King Bokor  J. Chenming Hu Central Res. Lab.  Hitachi Ltd.  Tokyo  Japan;  

  • Abstract:  Abstract MOSFETs with gate length down to 17 nm are reported. To suppress the short channel effect, a novel self-aligned double-gate MOSFET, FinFET, is proposed. By using boron-doped Si0.4Ge0.6 as a gate material, the desired threshold voltage was achieved for the ultrathin body device. The quasiplanar nature of this new variant of the vertical double-gate MOSFETs can be fabricated relatively easily using the conventional planar MOSFET process technologies.

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